Course
Objectives: To provide an understanding and insight into-
·
The similarities and differences between magnetron,
diode, triode, and ion beam systems.
·
The different types of power used for sputtering
and for biasing of substrates.
·
The effects process parameters on the structure and
properties of the deposited films.
·
The basics of reactive sputtering.
·
High power pulsed magnetron sputtering.
Course Description
Sputtering is used to deposit films for a wide
variety of applications including optical, electronic, magnetic, tribological, solar cell, decorative, and
architectural. In this course, you will
come to understand how the sputtering process works and how the process
parameters greatly affect the structure and properties of the deposited
films. The course provides an
understanding of the cause and effect of changes in sputtering parameters on
the energetics of the sputtering and deposition
processes and their relationship to film properties. The energy and distribution of species
ejected from the target are discussed.
The effect of the sputtering system on material transport to the
substrate and subsequent film deposition is also discussed for films and
metals, alloys, and compounds. The
parameters of different sputtering systems (diode, triode, magnetron, and ion
guns) with DC and RF power supplies are discussed with respect to film
properties. The basics of reactive sputtering are presented to give the student
an appreciation of the process, and finally the newly developing field of high
power pulsed magnetron sputtering is discussed to show the potential power of
this new technique.
Who Should
Attend?
Higher degree
students, research scientists, engineers, technicians, and others involved or
who want to become involved in the sputter deposition of thin films.
Instructor:
William D.
Sproul, Founder and President of Reactive Sputtering, Inc. and Adjunct
Professor,
Course
Materials: Course Notes
Cost: $495.00
(Lunch
included)